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    • 专利摘要:
    glazing with electrical connection element and compensating plates. glazing with at least one connecting element (4) with compensating plates (3), comprising at least: - a substrate (1) with an electrically conductive structure (2) on at least a part of the substrate (1), - at least a compensator plate (3) on at least one part of the conductive structure (2), - at least one electrical connection element (4) on at least a part of the at least one compensator plate (3), - a welding compound lead-free (5), which connects the compensator plate (3) via at least one contact surface (7) in at least a part of the electrically conductive structure (2), in which the difference in the substrate's thermal expansion coefficients ( 1) and the compensator plate (3) is less than 5 x 10 (-6) / °c and where the connecting element (4) contains copper.
    公开号:BR112015010474B1
    申请号:R112015010474-6
    申请日:2013-07-18
    公开日:2021-08-10
    发明作者:Mitja Rateiczak；Bernhard Reul；Klaus Schmalbuch
    申请人:Saint-Gobain Glass France；
    IPC主号:
    专利说明:

    [0001] The invention refers to a panel with an electrical connection element, an economical and environmentally friendly method for its production, and its use.
    [0002] The invention further relates to a panel with an electrical connection element for motor vehicles, with electrically conductive structures, such as, for example, heating conductors or antenna conductors. Electrically conductive structures are customarily connected to the system onboard via soldered electrical connection elements. Due to different coefficients of thermal expansion of the materials used, mechanical stresses occur during production and operation, which stress the panels and can cause panel breakage.
    [0003] Lead-containing solders have high ductility, which can compensate for the mechanical stresses occurring between an electrical connection element and the panel, by plastic deformation. However, due to the End of Life Vehicles Directive 2000/53/EC, lead-containing solders have to be replaced by lead-free solders within the EC. The directive is referred to, in short, by the acronym ELV (End of Life Vehicles). Their goal is, as a result of the massive increase in disposable electronics, to ban extremely problematic components from products. Substances affected are lead, mercury, cadmium and chromium. This refers, among other things, to the implementation of lead-free solder materials in electrical applications on glass and the introduction of corresponding replacement products.
    [0004] The lead-free solder compounds known to date, as described, for example, in EP 2 339 894 A1 and WO 2000058051, are not, however, able to compensate for mechanical stresses to the same extent as lead due to their lower ductility. Customary copper-containing connecting elements do, however, have a higher coefficient of thermal expansion than glass (CTE(copper) = 16.8 x 10-6 oC), as a result of which glass damage occurs in the thermal expansion of the glass. copper. For this reason, connecting elements having a low coefficient of thermal expansion, preferably of the order of magnitude of soda-lime glass (8.3 x 10-6 oC for 0 oC - 320 oC), are preferably used together with lead-free solder compounds. Such connecting elements hardly expand on heating and compensate for the stresses developing.
    [0005] EP 1 942 703 A2 describes an electrical connection element in motor vehicle panels, in which the difference between the coefficients of thermal expansion of the panel and the electrical connection element is < 5 x -10-6/oC and the connecting element predominantly contains titanium. In order to provide adequate mechanical stability and processability, the use of an excess of solder compound is proposed. Excess solder compound flows out of the intermediate space between the connecting element and the electrically conductive structure. Excess solder compound causes high mechanical stresses on the glass panel. These mechanical stresses ultimately result in panel breakage. Additionally, titanium has poor weldability. This results in poor adhesion of the panel connecting element. In addition, the connecting element must be connected to the on-board electrical system via an electrically conductive material, eg copper, possibly by soldering. Titanium has poor weldability.
    [0006] EP 2 408 260 A1 describes the use of ferronickel alloys or ferronickel-cobalt alloys, such as, for example, Kovar or Invar, which have a low coefficient of thermal expansion (CTE). Both Kovar (CTE = 5 X 10-6/oC) and Invar (CTE as low as 0.55 x 10-6/oC depending on composition) have a lower CTE than soda-lime glass and compensate for stresses mechanics. Invar has such a low coefficient of thermal expansion that overcompensation of these mechanical stresses occurs. This results in compressive stresses in the glass or tensile stresses in the alloy, which are, however, considered non-critical.
    [0007] Connecting elements made of copper, which are used in conjunction with lead-containing soldering compounds, are unsuitable for soldering with known lead-free soldering compounds in glass due to their high coefficient of expansion. Connecting elements made of iron or titanium, in fact, have a lower coefficient of expansion and are compatible with lead-free soldering compounds; however, these materials are substantially more difficult to mold. Thus, the service life of the tools required for the production of the connecting elements is reduced, which results in an increase in production costs. Furthermore, with the materials and shapes of the connecting elements changing, the basic conditions of the welding procedure have to be continually varied. Different connecting elements also have different mechanical strength relative to tensile forces. Standardization would thus be desirable to ensure consistent mechanical stability and uniform welding behavior.
    [0008] The purpose of the present invention is to provide a panel with an electrical connection element, as well as an economical and environmentally friendly method for its production, in which critical mechanical stresses in the panel are avoided and the manufacturing process is simplified by standardizing the welding procedure, independent of the material and shape of the connecting element.
    [0009] The purpose of the present invention is carried out according to the invention by a panel with a connecting element, a method for its production and its use according to independent claims 1, 13 and 14. Preferred embodiments evident by sub-claims.
    [0010] The purpose of the present invention is carried out according to the invention by a panel with at least one connecting element with compensating plates. The panel comprises at least one substrate with an electrically conductive structure on at least a part of the substrate, at least one compensator plate on at least a part of the conductive structure, at least one electrical connection element on at least a part of the compensator plate, as well as a lead-free soldering compound, which connects the buffer plate via at least one contact surface to at least a portion of the electrically conductive structure. The difference in the thermal expansion coefficients of the substrate and the buffer plates is less than 5 x 10-6/oC and the connecting element contains copper.
    [0011] The thermal expansion coefficient of the compensator plates is preferably between 9 x 10-6/oC and 13 x 10-6/oC, particularly preferable between 10 x 10-6/oC and 12 x 10-6/oC, plus particularly preferable between 10 x 10-6/oC and 11 x 10-6/oC over a temperature range of 0oC to 300oC.
    [0012] Through the use of the compensator plate according to the present invention, even conventional connecting elements made of copper can be used in conjunction with lead-free soldering compounds. According to the prior art, the connecting element is soldered by means of the lead-free soldering compound without a buffer plate directly onto the electrically conductive structure of the substrate, as a result of which substrate failure occurs in temperature cycling tests . Such failures are not observed in the panel according to the present invention, since the compensator plate compensates for the voltages that occur. The material of the buffer plates is selected so that the difference in thermal expansion coefficients of the substrate and the buffer plates is less than 5 x 10-6/oC. Thus, the substrate and compensator plates expand during heating to the same extent and damage to the solder joint is avoided. Since conventional copper-containing connecting elements from the past can still be used, no tool conversion is required. Furthermore, copper-containing materials are, as a rule, readily moldable. The connecting elements known according to the prior art, which can also be used in conjunction with lead-free soldering compounds, are instead made of weakly moldable materials such as steel or titanium. For this reason, the service life of the tools is significantly higher with the molding of the copper-containing connecting elements. The use according to the present invention of compensator plates thus results in a reduction of production costs, with respect to the molding process.
    [0013] In addition, connecting elements made of steel or titanium, weldable with lead-free welding compounds, according to the prior art, have significantly higher electrical resistance, and compared to conventional copper-containing connecting elements. By combining, according to the present invention, the compensating plates, which ensure good thermostability of the welding joint, with connection elements containing copper, which have high electrical conductivity, the advantages of the various materials are optimally used, without the disadvantageous material properties manifesting. Therefore, the proportion of material with high strength can be reduced to a minimum while retaining the same temperature stability of the panel.
    [0014] Furthermore, through the use of the compensator plate according to the present invention, standardization of the welding procedure is achieved. Compensation plates form the contact base for connecting elements and other connectors of all types and thus serve not only as compensators but also as adapters. Through the use of the always identical standardized compensator plates, the conditions of the welding joint remain constant and the welding procedure does not need to be adapted even with a change in the shapes and materials of the connecting elements. In addition, the mechanical conditions of the weld joint remain constant, so the tensile forces are independent of the shape of the connecting element.
    [0015] The number of compensator plates used depends on the geometry of the connecting element. If the connecting element is intended to be connected to the electrically conductive structure via only one surface, a buffer plate on the side of the connecting element, which is to be connected to the electrically conductive structure, is sufficient.
    [0016] In a preferred embodiment, the electrical connection element is electrically and conductively connected via a first compensator plate and a second compensator plate to the electrically conductive structure. The connecting element can, for example, be implemented in the form of a bridge, where the connecting element has two feet, between which there is a raised section that does not make direct surface contact with the electrically conductive structure. The connecting element can have either a simple bridge shape or more complex bridge shapes. The two feet of the connecting element rest on top of each balancer plate.
    [0017] The compensator plates have, in their lower part, contact surfaces with which they are applied on the entire surface in the electrically conductive structure. Preferably, the compensator plates and contact surfaces have no corners. Such design realizes uniform tensile stress distribution, without maximum values in corners, like uniform weld distribution.
    [0018] Compensator plates contain titanium, iron, nickel, cobalt, molybdenum, copper, zinc, tin, manganese, niobium and/or chromium and/or their alloys.
    [0019] Preferably, the compensator plates contain a chromium-containing steel, with a chromium content greater than or equal to 10.5% by weight. Other alloy components, such as molybdenum, manganese or niobium, result in improved corrosion resistance or altered mechanical properties, such as tensile strength or cold moldability.
    The compensator plates according to the present invention preferably contain at least 66.5% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0% by weight to 1% by weight carbon, 0% by weight to 5% by weight nickel, 0% by weight to 2% by weight manganese, 0% by weight to 2.5% by weight molybdenum, 0% by weight to 2% by weight of niobium, and 0% by weight to 1% by weight of titanium. Compensator plates can additionally contain mixtures of other elements, including vanadium, aluminum and nitrogen.
    Particularly preferred compensator plates contain at least 73 wt% to 89.5 wt% iron, 10.5 wt% to 20 wt% chromium, 0 wt% to 0.5% wt. weight carbon, 0% by weight to 2.5% by weight nickel, 0% by weight to 1% by weight manganese, 0% by weight to 1.5% by weight molybdenum, 0% by weight to 1 wt% niobium and 0 wt% to 1 wt% titanium. In addition, mixtures of other elements can be contained, including vanadium, aluminum and nitrogen.
    The compensator plates very particularly and preferably contain at least 77% by weight to 84% by weight of iron, 16% by weight to 18.5% by weight of chromium, 0% by weight to 0.1% by weight of carbon, 0% by weight to 1% by weight of manganese, 0% by weight to 1% by weight of niobium, 0% by weight to 1.5% by weight of molybdenum and 0% by weight to 1% by weight of titanium. Compensator plates may contain additional mixtures of other elements including vanadium, aluminum and nitrogen.
    [0023] Chromium containing steel, in particular called stainless steel, is economically available. Chromium containing steel also has, compared to copper and copper alloys, high rigidity, which results in advantageous stability of the balancer plates. Also the compensator plates made of steel containing chromium have, compared to many conventional connecting elements, for example those made of titanium, improved weldability, resulting from the higher thermal conductivity.
    [0024] Materials particularly suitable for use as buffer plates are chrome-containing steels of material numbers 1.4016, 1.4113, 1.4509 and 1.4510 as per EN 10 088-2.
    The compensator plates preferably have a material thickness of 0.1 mm to 1 mm, particularly preferable 0.4 mm to 0.8 mm. Within these ranges, sufficient mechanical stability is optimally ensured. The width and length of the balancer plates can be individually adapted to the connecting elements used and the shape of their feet. However, in order to obtain advantageous standardization of the compensator plates, round, circular or elliptical shapes, in particular circular shapes, are particularly preferably used. In a more particularly preferred circular embodiment of the balancer plates, they have a diameter of 2 mm to 15 mm, preferably 4 mm to 10 mm.
    [0026] In addition to copper, the connecting element preferably contains titanium, iron, nickel, cobalt, molybdenum, copper, zinc, tin, manganese, niobium and/or chromium and/or their alloys. A suitable material composition is selected according to its electrical resistance.
    [0027] In a preferred embodiment, the connecting element contains 45.0% by weight to 99.9% by weight copper, 0% by weight to 45% by weight zinc, 0% by weight to 15% by weight of tin, 0% by weight to 30% by weight of nickel and 0% by weight to 5% by weight of silicon. In addition to electrolytic copper, a wide variety of brass or bronze alloys, eg nickel silver or Konstantan, are suitable as materials.
    [0028] The connecting element particularly and preferably contains 58% by weight to 99.9% by weight of copper and 0% by weight to 37.0% by weight of zinc, in particular 60% by weight to 80% by weight of copper and 20% by weight to 40% by weight of zinc.
    [0029] As a particular example of the connecting element material, electrolytic copper, with material number CW004A (formerly 20065) and CuZn30 with material number CW505L (formerly 2.0265), should be mentioned.
    [0030] In a preferred embodiment, the material of the connecting element has electrical resistance between 1.0 μ Ohm.cm and 15 μ Ohm.cm, particularly preferable between 1.5 μ Ohm.cm and 11 μ Ohm.cm . This produces a particularly advantageous combination of compensator plates with a substrate-adapted CTE and a connecting element with very good conductivity. Prior art connecting elements, which also have a coefficient of thermal expansion adapting to the substrate, have higher electrical resistances, so that a disadvantageously increased voltage drop occurs.
    [0031] The material thickness of the connecting element is preferably from 0.1 mm to 2 mm, particularly preferable 0.2 mm to 1 mm, most highly particularly preferable 0.3 mm and 0.5 mm. In a preferred embodiment, the material thickness of the connecting element is constant over its entire area. This is particularly advantageous with respect to the simple manufacture of the connecting element.
    [0032] The connecting element is connected to the electronics on board the motor vehicle via a connecting cable. The electrical contact of the connecting element with the connecting cable can be made via a soldered or crimped connection.
    [0033] Suitable connection cables for the contact of the connecting element are, in principle, all cables that are known to the person skilled in the art for the electrical contact of an electrically conductive structure. The connecting cable may include, in addition to an electrically conductive core (internal conductor), an insulating coating, preferably polymeric, with the insulating coating preferably removed at the end region of the connecting cable, in order to enable an electrical connection between the element. connection and the inner conductor.
    [0034] The electrically conductive core of the connecting cable may contain, for example, copper, aluminum and/or silver or alloys or mixtures of them. The electrically conductive core can be implemented, for example, as a stranded wire conductor or as a solid wire conductor. The cross section of the electrically conductive core of the connecting cable is determined in accordance with the current carrying capacity required for the use of the panel in accordance with the present invention and can be appropriately selected by the person skilled in the art. The cross section is, for example, from 0.3 mm2 to 6 mm2.
    [0035] The connecting element is electrically and conductively connected to the compensator plates, with the possibility of connecting the elements through various welding techniques. The compensator plates and the connecting element are preferably connected by electrodic resistance welding, ultrasonic welding or friction welding.
    [0036] In an alternative embodiment, the connecting element can also be applied to the compensator plates via a screw connection or a plug connection. Such contact can be made, for example, by a compensator plate with a threaded pin, onto which a connecting element with a threaded sleeve is screwed.
    [0037] In an advantageous embodiment of the invention, the connecting element covers only a part of the surface of the compensating plates. A part of the compensating plates thus projects laterally under the connecting element and is accessible on the compensating plates, even after fixing the connecting element. When welding the compensator plates onto the electrically conductive structure, these protrusions can serve to contact the compensator plates.
    [0038] An electrically conductive structure, which preferably contains silver, particularly preferably silver particles and glass frits, is applied to at least a part of the panel. The electrically conductive structure according to the invention preferably has a layer thickness of 3 μm to 40 μm, particularly preferable from 5 μm to 20 μm, most highly particularly preferable from 7 μm to 15 μm and in particular 8 µm to 12 µm. The compensator plates, on which the connecting element is applied, are connected on the entire surface to an electrically conductive part of the structure via a contact surface. Electrical contact is made via lead-free soldering compound. The electrically conductive structure can, for example, serve for wire contact or a coating applied to the panel. The electrically conductive structure is applied, for example, in the form of distribution bars on opposite edges of the panel. A voltage can be applied via the connecting elements with compensating plates applied on the distribution bars, whereby a current flows through the conducting wires or the coating from one busbar to the other and heats the panel. Alternatively to such a heating function, the panel according to the present invention is also usable in combination with antenna conductors or also conceivable in any other arrangements, where stable panel contact is required.
    The substrate preferably contains glass, particularly preferably flat glass, float glass, quartz glass, borosilicate glass and/or soda-lime glass. The substrate may, however, also contain polymers, preferably polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polystyrene, polybutadiene, polynitriles, polyesters, polyurethane, polyvinyl chloride, polyacrylate, polyamide, polyethylene terephthalate and/or copolymers or mixtures thereof. The substrate is preferably transparent. The substrate preferably has a thickness of from 0.5mm to 25mm, particularly preferably from 1mm to 10mm and most particularly preferably from 1.5mm to 5mm.
    [0040] The thermal expansion coefficient of the substrate is preferably from 8 x 10-6/oC to 9 x 10-6/oC. The substrate preferably contains glass which preferably has a thermal expansion coefficient of 8.3 x 10-6/oC to 9 x 10-6/oC over a temperature range of 0oC to 300oC.
    [0041] Optionally, a seritypal, which hides the panel contact in the installed state of the panel, is applied over the substrate, so that the connecting element with compensating plates is not discernible from the outside.
    [0042] The electrically conductive structure is electrically and conductively connected to the compensator plates via the lead-free soldering compound. The lead-free soldering compound is disposed on the contact surfaces, which are located at the bottom of the connecting element.
    [0043] The layer thickness of the lead-free soldering compound is preferably less than or equal to 600 μm, particularly preferable between 150 μm and 600 μm, in particular less than 300 μm.
    [0044] The lead-free soldering compound is preferably lead-free. This is particularly advantageous with respect to the environmental impact of the panel according to the invention with an electrical connection element. In the context of the invention, "lead-free soldering compound" means a soldering compound which, according to EC Directive "2002/95/EC on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment", has content of lead less than or equal to 0.1% by weight, preferably no lead.
    Lead-free solder compounds typically have less ductility than lead-containing solder compounds, so mechanical stresses between a connecting element and a panel may be less well compensated for. However, it has been demonstrated that critical mechanical stresses can be avoided by means of the connecting element with compensator plates according to the present invention. The soldering compound preferably contains tin and bismuth, indium, zinc, copper, silver or compositions thereof. The tin content of the soldering compound according to the present invention is from 3% by weight to 99.5% by weight, preferably from 10% by weight to 99.5% by weight, particularly preferably 15% by weight to 60 % % by weight. The content of bismuth, indium, zinc, copper, silver or their compositions is 0.5% by weight to 97% by weight, preferably 10% by weight to 67% by weight, wherein the content of bismuth, indium, zinc , copper or silver can be 0% by weight. The solder composition can contain nickel, germanium, aluminum or phosphorus, with a content of 0% by weight to 5% by weight. The soldering composition according to the present invention contains, very particularly preferably, Bi40Sn57Ag3, Sn40Bi57Ag3, Bi59Sn40Ag1, Bi57Sn42Ag1, In97Ag3, In60Sn36.5Ag2Cu1.5, Sn95.5Ag3.8Cu0.7, Bi67In33, Bi33In50Sn17, Sn77,2 Sn95Ag4Cu1, Sn99Cu1, Sn96.5Ag3.5, Sn96.5Ag3Cu0.5, Sn97Ag3, or mixtures thereof.
    [0046] In an advantageous embodiment, the solder material contains bismuth. It has been shown that a bismuth-containing solder material results in particularly good adhesion of the connecting elements, according to the present invention, to the panel, while at the same time, failure of the panel can be avoided. The proportion of bismuth content in the solder composition is preferably from 0.5% by weight to 97% by weight, particularly preferably 10% by weight to 67% by weight and very particularly preferably from 33% by weight to 67% by weight. weight, in particular from 50% by weight to 60% by weight. The soldering compound preferably contains, in addition to bismuth, tin, silver and copper. In a particularly preferred embodiment, the soldering compound contains at least 35% by weight to 69% by weight bismuth, 30% by weight to 50% by weight tin, 1% by weight to 10% by weight silver and 0 wt% to 5 wt% copper. In a most highly particularly preferred embodiment, the soldering compound contains at least 49% by weight to 60% by weight of bismuth, 39% by weight to 42% by weight of tin, 1% by weight to 4% by weight of silver, and 0 wt% to 3 wt% copper.
    [0047] In another advantageous embodiment, the solder material contains from 90% by weight to 99.5% by weight of tin, preferably from 95% by weight to 99% by weight, particularly preferable from 95% by weight to 98% by weight. The soldering compound preferably contains, in addition to tin, from 0.5% by weight to 5% by weight of silver and from 0% by weight to 5% by weight of copper.
    [0048] The welding compound flows out with an outflow width of preferably less than 1 mm between the intermediate space between the area of the compensator plates and the electrically conductive structure. In a preferred embodiment, the maximum outflow width is less than 0.5 mm and in particular approximately 0 mm. This is particularly advantageous with respect to reducing the mechanical stresses of the panel, the adhesion of the connecting element and the reduction in the amount of soldering. The maximum efflux width is defined as the distance between the outer edges of the weld area and the crossing point of the weld compound, where the weld compound falls below a layer thickness of 50 μm. The maximum flux width is measured on the solidified weld compound after the welding process. The maximum desired efflux width is obtained by an adequate selection of the volume of solder compound and by the vertical distance between the pressure plates and the electrically conductive structure, which can be determined by simple experiments. The vertical distance between the compensator plates and the electrically conductive structure can be predefined by an appropriate process tool, eg a tool with an integrated spacer. The maximum outflow width can even be negative, that is, retreat into the intermediate space formed by the welding area of the compensating plates and the electrically conductive structure. In an advantageous embodiment of the panel according to the present invention, the maximum outflow width, in the intermediate space formed by the welding area of the compensator plates and the electrically conductive structure, is recessed in a concave meniscus. A concave meniscus is created, for example, by increasing the vertical distance between the spacer and the conducting structure during the welding procedure while the weld is still fluid. The advantage lies in the reduction of mechanical stresses in the panel, particularly in the critical region which is present with a large crossover of welding compound.
    [0049] In an advantageous embodiment of the invention, the contact surfaces of the balancer plates have spacers, preferably at least two spacers, particularly preferably at least three spacers. The spacers are preferably formed in one piece with the balancer plates, for example, by stamping or deep drawing. The spacers preferably have a width of 0.5 x 10-4m to 10 x 10-4m and a height of 0.5 x 10-4m to 5 x 10-4m, particularly preferable from 1 x 10-4m to 3 x 10 -4 m. By means of spacers, a homogeneous, uniformly thick and uniformly fused layer of the soldering compound is obtained. Thus, the mechanical stresses between the balancer plates and the panel can be reduced and the adhesion of the balancer plates can be improved. This is, in particular, especially advantageous with the use of lead-free soldering compounds, which can compensate less for mechanical stresses due to their lower ductility, compared to lead-containing soldering compounds.
    [0050] In an advantageous embodiment of the invention, the compensator plates and/or the connecting element are equipped with contact stops, which serve to make contact with the welding tool during the welding procedure. The contact stops are arranged on the surface of the balancer plates, facing away from the substrate opposite the contact surfaces, or on the surface of the connecting element, facing away from the substrate, in the region that is situated above the balancer plates. The contact stops are preferably formed convexly curved, at least in the region of contact with the welding tool. The contact stops preferably have a height of 0.1 mm to 2 mm, particularly preferably 0.1 mm to 1 mm. The length and width of the contact stops are preferably between 0.1 and 5 mm, most particularly preferable between 0.4 mm and 3 mm. The contact stops are preferably formed in one piece with the balancer plates or the connecting element, for example, by stamping or deep drawing. For welding, electrodes whose contact side is formed flat can be used. The electrode surface is brought into contact with the contact stop. During this process, the electrode surface is arranged parallel to the substrate surface. The contact area between the electrode surface and the contact abutment forms the solder joint. The position of the solder joint is determined by the point on the convex surface of the contact stop, which has the greatest vertical distance from the substrate surface. The position of the weld joint is independent of the position of the welding electrode on the compensator plates or connecting element. This is particularly advantageous with respect to reproducible and uniform thermal distribution during the welding procedure. The heat distribution during the welding procedure is determined by the position, size, arrangement and geometry of the contact pad.
    [0051] The compensator plates preferably have, at least on the contact surface oriented towards the welding compound, a coating (wetting layer) that contains nickel, copper, zinc, tin, silver, gold or their alloys or layers, preferably silver. Thus, improved wetting of the balancer plates with the soldering compound and improved adhesion of the balancer plates are obtained.
    [0052] The compensator plates according to the present invention are preferably coated with nickel, tin, copper and/or silver. The compensator plates are particularly preferably provided with an adhesion-promoting layer, preferably made of nickel and/or copper, and additionally with a solderable layer, preferably made of silver. The compensator plates according to the present invention are more particularly preferably coated with 0.1 µm to 0.3 µm of nickel and/or 3 µm to 20 µm of silver. Compensator plates can be galvanized with nickel, tin, copper and/or silver. Nickel and silver improve the current-carrying capacity and corrosion stability of the balancer plates and wetting with the welding compound.
    [0053] The connecting element can optionally also have a coating. The coating of the connecting element is, however, not essential as there is no direct contact between the connecting element and the welding compound. Thus, no optimization of the wetting properties of the connecting element is necessary. Thus, the production costs of the panel according to the present invention with a connecting element and compensator plates are reduced, since large-area coating of the connecting element can be dispensed with and only the usually significantly smaller surface of the compensator plates is coated.
    [0054] In an alternative embodiment, the connecting element has a coating that contains nickel, copper, zinc, tin, silver, gold or their alloys or layers, preferably silver. Preferably, the connecting element is coated with nickel, tin, copper and/or silver. More particularly preferably, the connecting element is coated with 0.1 µm to 0.3 µm nickel and/or 3 µm to 30 mm silver. The connecting element can be galvanized with nickel, tin, copper and/or silver.
    [0055] The shape of the buffer plates can form one or a plurality of solder deposits in the intermediate space of the buffer plate and electrically conductive structure. Weld deposits and the wetting properties of the weld in the compensator plates prevent the efflux of the welding compound from the space. Weld deposits can be implemented rectangular, rounded or polygonal.
    [0056] The invention further comprises a method of producing a panel with a connecting element and one or a plurality of compensating plates, including the following steps:
    [0057] a) a connecting element is electrically and conductively fixed on top of one or a plurality of compensator plates,
    [0058] b) a lead-free soldering compound is applied to at least one contact surface at the bottom of one or a plurality of compensator plates,
    [0059] c) the compensator plates are arranged with the lead-free soldering compound in an electrically conductive structure on a substrate, and
    [0060] d) the compensator plates are welded to the electrically conductive structure.
    [0061] The electrically conductive structure can be applied on the substrate using methods known per se, for example, by seritypal methods. The application of the electrically conductive structure can be done before, during or after process steps (a) and (b).
    [0062] The soldering compound is preferably applied as flat platelets or drops, with a fixed thickness, volume, shape and arrangement on the compensator plates. The layer thickness of the soldering compound plate is preferably less than or equal to 0.6 mm. The shape of the solder compound pads corresponds to the shape of the contact surface. If the contact surface is implemented, for example, as a rectangle, the solder compound plate preferably has a rectangular shape.
    [0063] The introduction of energy during the electrical connection of the compensator plates and the electrically conductive structure is preferably done with punches, thermos, piston welding, micro-flame welding, preferably laser welding, hot air welding, induction welding, welding of resistance and/or with ultrasound.
    [0064] Preferably, the connecting element is welded or fixed by means of a screw connection or a snap connection on top of the balancer plates. Particularly preferable, the connecting element is fixed by electrode resistance welding, ultrasonic welding or friction welding.
    [0065] After installation of the panel in the motor vehicle, the connecting element is soldered or crushed into a sheet, a twisted wire, or a braid, for example, made of copper, and connected to the electronics on board.
    [0066] The invention also includes the use of the panel according to the present invention, with electrically conductive structures in motor vehicles, architectural glass or structural glass, and particularly in automobiles, railroad vehicles, aircraft or marine vessels. A connection element with compensator plates is used for connecting electrically conductive panel structures, eg heating conductors or antenna conductors, to external electrical systems, eg amplifiers, control units or voltage sources. The invention includes in particular the use of the panel according to the present invention in railroad vehicles or automobiles, preferably as a windshield, rear window, side window and/or roof panel, in particular as a heatable panel or a panel with an antenna function.
    [0067] The invention is explained in detail with reference to drawings and exemplary embodiments. The drawings are schematic representations and are not to full scale. The drawings in no way limit the invention. They represent:
    [0068] Fig. 1a, a top plan view of a panel according to the present invention, with a connecting element and compensator plate.
    [0069] Fig. 1b, a cross section of the panel according to Fig. 1, along section line AA’.
    [0070] Fig. 2a, a schematic perspective view of a panel according to the present invention, with a shaped connecting element in bridge and two compensating plates.
    [0071] Fig. 2b, a cross-section of the panel according to Fig. 2a, along section line BB’.
    [0072] Fig. 2c, a top plan view of the panel according to Fig. 2a.
    [0073] Fig. 3, a top plan view of the panel according to Fig. 2c, in which, additionally, a contact stop is applied on the compensator plates.
    [0074] Fig. 4, a top plan view of the panel according to Fig. 2c, in which, additionally, two contact stops are applied on the connecting element.
    [0075] Fig. 5a, a top plan view of the panel according to Fig. 2a, in which, additionally, two contact stops are applied on the compensator plates.
    [0076] Fig. 5b, a cross section of the panel according to Fig. 5a, along section line BB’.
    [0077] Fig. 6, a flowchart of the method according to the present invention, for producing a panel with a connecting element and compensator plates.
    Figs. 1a and 1b represent a panel according to the present invention, with a connecting element (4) and compensating plate (3). Fig. 1b represents a cross section along section line AA’. The cut surfaces of Fig. 1b are shown hatched. A masking serityp (6) is applied over a substrate (1) made of a 3 mm thick thermally prestressed single-pane safety glass made of soda-lime glass. The substrate (1) has a width of 150 cm and a height of 80 cm, with a connecting element (4) with a compensating plate (3) mounted on the short side edge of the region of the masking seritypy (6) . An electrically conductive structure (2), in the form of a heat conductive structure, is applied to the surface of the substrate (1). The electrically conductive structure contains silver particles and glass frits, with a silver content greater than 90%. The electrically conductive structure (2) is widened to 10 mm in the edge region of the panel. In this region, a lead-free soldering compound (5), which connects the electrically conductive structure (2) to a contact surface (7) at the bottom of the compensator plate (3), is applied. The contact surface (7) and lead-free soldering compound (5) are hidden in the top plan view of Fig. 1a by the compensator plate (3), but discernible in cross section (Fig. 1b). After installation in the motor vehicle body, the contact is hidden by the masking seritypy (6). The lead-free soldering compound (5) ensures a durable electrical and mechanical connection of the electrically conductive structure (2) to the buffer plate (3). The lead-free soldering compound (5) contains 57% by weight of bismuth, 42% by weight of tin and 1% by weight of silver. The lead-free soldering compound (5) has a thickness of 250 μm. The connecting element (4) consists of a flat folded sheet with a foot whose lower part is welded onto the top of the compensating plate (3). The bending of the connecting element is discernible in the cross section (Fig. 1b). The electrical connection element (4) is made of copper of material number CW004A (Cu-ETP) and has a contact surface with a width of 4 mm and a length of 6 mm. This material has low electrical resistance (1.8 μ Ohm.cm) and is particularly suitable as a connecting element (4) due to its high electrical conductivity. The material thickness of the connecting element (40 is 0.8 mm. The compensator plate (3) consists of a stamped circular sheet and has a height (material thickness) of 0.5 mm and a diameter of 4 mm. A compensator plate (3) is made of steel material number 1.4509 according to EN 10 088-2 (ThyssenKrupp Nirosta®4509). 4), made of copper, with a lead-free soldering compound (5). Thus, on the one hand, the mechanical stresses of the panel are avoided, while, however, the previously known connecting elements (4), made of copper or copper alloys can still be used. In addition, the manufacturing process can be simplified by standardizing the welding procedure regardless of the material and shape of the connecting element (4), as the welding procedure parameters depend on only of the compensator plates (3) used. This one results was surprising and unexpected for the person skilled in the art.
    [0079] Figures 2a, 2b and 2c represent different views of a panel according to the invention, with a shaped connecting element in bridge (4) and two compensating plates (3). Fig. 2a represents a perspective view of the panel. Fig. 2b is a cross section along section line BB’ and Fig. 2c a top plan view. The cut surfaces are shown hatched in Fig. 2b. A masking serityp (6) is applied over a substrate (1) made of a simple thermally prestressed security panel 3 mm thick, made of soda-lime glass. The substrate (1) has a width of 150 cm and a height of 80 cm, with a connecting element (4) with compensating plates (3) mounted on the short side edge in the region of the masking seritypy (6). An electrically conductive structure (2), in the form of a heat conductive structure, is applied to the surface of the substrate (1). The electrically conductive structure contains silver particles and glass frits, with silver content greater than 90%. The electrically conductive structure (2) is extended to 10 mm in the panel region. In this region, a lead-free soldering compound (5), which connects the electrically conductive structure (2) to the contact surfaces (7.1, 7.2) at the bottom of the compensator plates (3), is applied. After installation in the motor vehicle body, the contact is hidden by the masking seritypy (6). The lead-free soldering compound (5) ensures a durable electrical and mechanical connection from the electrically conductive structure (2) to the compensator plates (3) and to the connecting element (4). The lead-free soldering compound (5) contains 57% by weight of bismuth, 42% by weight of tin and 1% by weight of silver. The lead-free soldering compound (5) has a thickness of 250 μm. The connecting element (4) is in the form of a bridge. The connecting element (4) includes two feet, which rest on the first balancer plate (3.1) and the second balancer plate (3.2), as well as a bridge-shaped section that extends between the feet. In the bridge-shaped section, the connecting element (4) does not rest on the compensating plates (3) nor on the electrically conductive structure (2). The electrical connecting element (4) has a width of 4 mm and a length of 24 mm and is made of copper material number CW004A (Cu-ETP). This material has low electrical resistance (1.8 μ Ohm.cm) and is particularly suitable as a connecting element (4) due to its high electrical conductivity. The material thickness of the connecting element (4) is 0.4 mm. The compensating plates (3.1, 3.2) consist of circular stamped sheets and in each case have a height (material thickness) of 0.5 mm and a diameter of 6 mm. The compensator plates (3.1, 3.2) are made of steel of material number 1.4509 as per EN 10 088-2 (ThyssenKrupp Nirostat®4509). Compensator plates (3.1, 3.2) compensate for mechanical stresses and thus make it possible to combine a connecting element (4) made of copper with a lead-free soldering compound (5).
    [0080] Fig. 3 represents a top plan view of the panel according to Fig. 2c, in which, additionally, a contact stop (9) is applied on the compensator plates (3). The contact stops (9) are arranged on the surface of the compensator plates (3) facing away from the substrate opposite the contact surfaces. The contact stops (9) are stamped on the compensator plates (3) and thus formed in one piece with them. The contact stops (9) are formed as spherical segments and have a height of 2.5 x 10-4m and a width of 5 x 104m. Contact stops (9) are used to contact the compensator plates (3) with the welding tool during the welding procedure. By means of the contact stops (9), reproducible and defined heat distribution is ensured regardless of the exact positioning of the welding tool.
    [0081] Fig. 4 represents a top plan view of the panel according to Fig. 2c, in which, additionally, two contact stops (9) are applied on the connecting element (4). The design of the contact stops (9) corresponds to that described in Fig. 3, with, and contrast to it, the contact stops (9) arranged on the connecting element (4) itself in the region that is situated above the compensating plates (3). This design is advantageous with respect to optimal heat distribution in the compensator plates (3) during the welding procedure.
    [0082] Fig. 5a represents a top plan view of the panel according to Fig. 2c, in which, additionally, two contact stops (9) are applied on the compensator plates (3). The design of the contact stops (9) corresponds to that described in Fig. 3, with each trim plate (3.1, 3.2) containing two contact stops (9). The contact stops (9) face the feet of the connecting element (4) and are arranged laterally to them.
    [0083] Fig. 5b represents a cross section of the panel according to Fig. 5a along section line CC’. Cutting surfaces are shown hatched. Three spacers (8), two of which are discernible since they lie in the cross-sectional plane, are arranged on the first contact surface (7.1) of the first compensator plate (3.1). The second trim plate (3.2) (not shown in this figure) is equipped with contact stops (9) and spacers (8), similarly to the first trim plate (3.1). The spacers (8) are stamped on the balancer plates (3) of the contact surfaces (7) and are thus formed in one piece with them. The spacers (8) are formed as spherical segments and have a height of 2.5 x 10-4m and a width of 5 x 10-4m. The spacers (8) promote the formation of a uniform layer of lead-free soldering compound (5). This is particularly advantageous with respect to the adhesion of the compensator plates (3). The contact stops (9) are disposed on the surface of the compensator plates (3) facing away from the substrate (1) opposite the contact surfaces (7). The spacers (8) and the contact stops (9) can, in principle, be positioned independently of each other; however, with stamping the elements, they should not overlap. The contact stops (9) shown in Fig. 3 and 4 can also be used in combination with spacers (8).
    [0084] Fig. 6 represents a flowchart of the method according to the present invention to produce a panel with a connecting element (4) and compensator plates (3). First, a connecting element (4) is electrically and conductively fixed on top of the balancer plates (3). Then, a lead-free soldering compound (5) is applied to the underside of the compensator plates (3) on at least one contact surface (7) and the compensator plates (3) with the lead-free soldering compound ( 5) are arranged on the electrically conductive structure (2). The compensator plates (3) are then welded to the electrically conductive structure (2). List of Reference Characters 1 transparent substrate 2 conductive structure 3 buffer plates 3.1 first buffer plate 3.2 second buffer plate 4 connecting element 5 lead-free solder compound 6 masking seritypy 7 contact surfaces 7.1 first contact surface 7.2 second surface of contact 8 spacer 9 contact stops AA' section line BB' section line CC' section line
    权利要求:
    Claims (13)
    [0001]
    1. Panel with at least one connecting element (4) with compensating plates (3), characterized in that it comprises: - a substrate (1) with an electrically conductive structure (2) on at least a part of the substrate (1 ), - at least one compensator plate (3) in at least a part of the conductive structure (2), - at least one electrical connection element (4) in at least a part of the at least one compensator plate (3), and - a lead-free soldering compound (5), which connects the compensator plate (3) via at least one contact surface (7) to at least a part of the electrically conductive structure (2), in which the difference in the coefficients of thermal expansion of the substrate (1) and compensator plate (3) is less than 5 x 10-6/oC, where the connecting element (4) contains copper, and where the electrical connecting element (4) is electrically and conductively connected via a first compensator plate (3.1) and a second compensator plate (3.2) to the structure electrically conductive (2).
    [0002]
    2. Panel according to claim 1, characterized in that the compensating plates (3) and the contact surfaces (7) are free of corners.
    [0003]
    3. Panel according to claim 1, characterized in that the compensator plates (3) contain titanium, iron, nickel, cobalt, molybdenum, copper, zinc, tin, manganese, niobium and/or chromium and/or their alloys, preferably iron alloys.
    [0004]
    4. Panel according to claim 3, characterized in that the compensating plates (3) contain at least 66.5% by weight to 89.5% by weight of iron, 10.5% by weight to 20% by weight of chromium, 0% by weight to 1% by weight of carbon, 0% by weight to 5% by weight of nickel, 0% by weight to 2% by weight of manganese, 0% by weight to 2.5% by weight of molybdenum, 0% by weight to 2% by weight of niobium and 0% by weight to 1% by weight of titanium.
    [0005]
    5. Panel according to claim 4, characterized in that the compensating plates (3) contain at least 77% by weight to 84% by weight of iron, 16% by weight to 18.5 % by weight of chromium 0% by weight to 0.1% by weight of carbon, 0% by weight to 1% by weight of manganese, 0% by weight to 1% by weight of niobium, 0% by weight to 1.5% by weight of molybdenum and 0 wt% to 1 wt% titanium.
    [0006]
    6. Panel according to claim 1, characterized in that the connecting element (4) contains 45.0% by weight to 99.9% by weight of copper, 0% by weight to 45% by weight of zinc, 0% by weight to 15% by weight of tin, 0% by weight to 30% by weight of nickel and 0% by weight to 5% by weight of silicon.
    [0007]
    7. Panel according to claim 6, characterized in that the connecting element (4) contains 58% by weight to 99.9% by weight of copper and 0% by weight to 37.0% by weight of zinc, preferably 60% by weight to 80% by weight copper and 20% by weight to 40% by weight zinc.
    [0008]
    8. Panel according to claim 1, characterized in that the electrically conductive structure (2) contains at least silver, preferably silver particles and glass frits, and has a layer thickness of 5 μm to 40 μm .
    [0009]
    9. Panel according to claim 1, characterized in that the substrate (1) contains glass, preferably flat glass, float glass, quartz glass, borosilicate glass and/or soda-lime glass.
    [0010]
    10. Panel according to claim 1, characterized in that the lead-free soldering compound (5) contains tin, bismuth, indium, zinc, copper, silver and/or their mixtures and/or alloys.
    [0011]
    11. Panel according to claim 10, characterized in that the lead-free soldering compound (5) contains 35% by weight to 69% by weight of bismuth, 30% by weight to 50% by weight of tin 1 wt% to 10 wt% silver and 0 wt% to 5 wt% copper.
    [0012]
    12. Method for producing a panel as defined in claim 1, characterized in that: a connecting element (4) is electrically and conductively fixed on top of one or a plurality of compensating plates (3), a free soldering compound of lead (5) is applied to at least one contact surface (7) at the base of the compensator plates (3), the compensator plates (3) are arranged with the lead-free soldering compound (5) in an electrically conductive structure (2) on a substrate (1), and the compensator plates (3) are welded to the electrically conductive structure (2).
    [0013]
    13. Use of a panel as defined in any one of claims 1 to 11, characterized in that it is as a panel with electrically conductive structures, preferably with heating conductors and/or antenna conductors, for motor vehicles, aircraft, ships, architectural glass and structural glass.
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    同族专利:
    公开号 | 公开日
    EP2923529A1|2015-09-30|
    PT2923529T|2017-03-07|
    WO2014079595A1|2014-05-30|
    MX2015006368A|2015-09-28|
    CA2891680C|2018-06-05|
    CA2891680A1|2014-05-30|
    MA38104A1|2016-08-31|
    ZA201503296B|2016-05-25|
    US9572200B2|2017-02-14|
    JP2016503568A|2016-02-04|
    KR101711314B1|2017-02-28|
    PL2923529T3|2017-06-30|
    MX344768B|2017-01-06|
    AU2013350059B2|2016-08-18|
    EP2923529B1|2016-12-07|
    JP2017147229A|2017-08-24|
    BR112015010474A2|2017-07-11|
    CN104782225B|2017-03-15|
    EA201590995A1|2015-08-31|
    ES2618514T3|2017-06-21|
    JP6440756B2|2018-12-19|
    MA38104B1|2017-03-31|
    KR20150076217A|2015-07-06|
    AU2013350059A1|2015-06-11|
    US20150296569A1|2015-10-15|
    EA029086B1|2018-02-28|
    CN104782225A|2015-07-15|
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    EP2729277B1|2011-07-04|2020-08-19|Saint-Gobain Glass France|Method for producing a pane with an electrical connection element|CN104620673B|2012-09-14|2017-09-22|法国圣戈班玻璃厂|Glass pane with electrical connecting element|
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    法律状态:
    2017-07-25| B08F| Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]|
    2017-08-08| B08G| Application fees: restoration [chapter 8.7 patent gazette]|
    2018-12-04| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-12-24| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-07-20| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-08-10| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 18/07/2013, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    EP12193521|2012-11-21|
    EP12193521.7|2012-11-21|
    PCT/EP2013/065175|WO2014079595A1|2012-11-21|2013-07-18|Disk having an electric connecting element and compensator plates|
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